Model: HDI Printed Circuits Board
Material: FR4
Lamination Stack: 1+N+1~6+N+6 and Anylayer
Layer: 40Layers
Min Hole : under 0.1mm diameter (Laser Drilling)
Min Trace/Space: 2mil/2mil
Special Process : Blind & Buried Hole , Half hole package edge
Surface Treatment: Immersion Gold,OSP,HALS and etc..
Manufacture from China (iPcb.com)
quote based on Gerber file
