Product Description

Model: HDI Printed Circuits Board

Material: FR4

Lamination Stack: 1+N+1~6+N+6 and Anylayer

Layer: 40Layers

Min Hole : under 0.1mm diameter (Laser Drilling)

Min Trace/Space: 2mil/2mil

Special Process :  Blind & Buried Hole , Half hole package edge

Surface Treatment: Immersion Gold,OSP,HALS and etc..

Manufacture from China (iPcb.com)

quote based on Gerber file

Payment Terms︰ T/T AT SIGHT

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